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Molded interconnect device : ウィキペディア英語版
Molded interconnect device

A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part through selective metallization.
==Applications==

Key markets for the MID technology are consumer electronic, telecommunication, automotive and medical. A very common application for MIDs are integrated antennas in cellphones and other mobile devices including laptops and netbooks.

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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