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Molded interconnect device : ウィキペディア英語版 | Molded interconnect device
A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part through selective metallization. ==Applications==
Key markets for the MID technology are consumer electronic, telecommunication, automotive and medical. A very common application for MIDs are integrated antennas in cellphones and other mobile devices including laptops and netbooks.
抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)』 ■ウィキペディアで「Molded interconnect device」の詳細全文を読む
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